Polymer
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By Design News Staff -- Design News, August 3, 1998
Accuspin(reg) T-23 low-organic siloxane polymer (LOSP) is for use in next-generation, sub-0.25-micron semiconductor manufacturing. The non-etchback organic polymer features gap-fill, planarization results, and thermal stability for use in processing multiple levels of metal. Accuspin T-23 is a hydrido organo siloxane polymer designed as a non-etchback inorganic material for gap-fill applications, and with the goal of retaining low k values over a wider process window than cage HSQ.
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